Electronic Ceramics(Fine Ceramics)

Leading Ceramics Substrate Products Professionals, production, design and customization of alumina ceramics substrates.

Our main products are : alumina ceramic substrate, direct bonding copper ceramics substrate, nickel plating DBC ceramic substrate, metallized ceramics substrate, heat radiating substrate, available in different specifications and shapes. We also have product design capacity, and can customize products.

The substrate has the advantages of small volume, good heat dissipation, low thermal resistance, and no pollution. It is widely used in thick film circuit, semiconductor refrigeration device, power electronic devices, power electronic device, such as CPU Integrated module.

  • Ceramic（No electrode）
  • Ceramic（No electrode）
  • Ceramic（No electrode）

Ceramic(No electrode)

  • DBC ceramic（Plated copper electrode）

    DBC ceramic(Plated copper electrode)

  • DBC ceramic（No plated copper electrode)

    DBC ceramic(No plated copper electrode)

  • Alumina Ceramic substrate

    Color White
    Density 3.70g/cm³
    Material ≥96% Alumina
    Water absorption 0.0%
    Compressive strength ≥294 MPa
    Coefficient of thermal expansion 6.8~7.8*10⁻⁶/℃
    Thermal conductivity ≥20 W/m.K
    Volume resistivity 10¹⁴Ω・cm
    Dielectric constant 9.5~10.2 （25℃ 1MHz）
    Dielectric loss angle tangent value 3×10⁻⁴（25℃ 1MHz）
    Dielectric breakdown strength ≥20KV/mm
    Surface Roughness 0.3~0.5 μm

  • DBC Ceramic

    Copper electrode Attachable as DBC circuit board(plated electrode also available)